From the course: Fusion 360: Simulation

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Analyze how air flow can contribute to cooling electronics

Analyze how air flow can contribute to cooling electronics - Fusion 360 Tutorial

From the course: Fusion 360: Simulation

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Analyze how air flow can contribute to cooling electronics

- [Instructor] When designing an electronics housing, it's important to discover whether or not the components of the PCB board will overheat. The electronics cooling preview in the simulation workspace will allow you to analyze how the individual components will respond to an electronic cooling. For this particular product, we want to analyze two different heat sink designs. So we're going to set up two studies and run them in parallel. First, we have a study with a simulation model that has all of the components inside. For clarity, let's turn off the housing top and heat sink two. Next, we need to define the important elements. We'll start out with the heat loads. We'll apply an internal heat, selecting the like components or the resistors, setting the units to Watts and the value for these resistors to 0.02 Watts. We'll repeat this process, here, I'll use the marking menu to do it, selecting the small elements.…

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